The first SuperGaN System-in-Package from Transphorm and Weltrend Semiconductor was released (SiP). A 45 to 100 Watt USB-C PD power adapter with the integrated circuit WT7162RHUG24A may charge smartphones, tablets, laptops, and other smart devices. It provides peak power efficiency of over 93%. Weltrend accomplishes another significant accomplishment and introduces a new product to the market with this release. This innovative GaN SiP, which makes use of Transphorm’s SuperGaN® technology to offer a whole-system solution, demonstrates Weltrend’s commitment to the AC-to-DC power market. It is another another crucial piece of proof for the outstanding performance and user-friendliness of Transphorm’s GaN devices. The recently released System-in-Package combines the 240 milliohms, 650-V SuperGaN FET from Transphorm with Weltrend’s WT7162RHSG08 multi-mode flyback PWM controller. The 24-pin 88 QFN package for the surface mount device reduces the size of the Board. The following are some of the new SiP’s primary specifications:
- Max Efficiency: greater than 93%
- 26 W/in3 Power Density
- Variety of Output Voltage 3.3V–21V and USB-C PD 3.0 are used for operation.
- optimum frequency: 180 kHz
This is the first IC solution in the product line of the GaN semiconductor company Transphorm, which is progressing toward providing customers with straightforward to-design-in power conversion solutions. Also, it represents Weltrend’s official position on the market for AC-to-DC power. At the Applied Power Electronics Conference in 2023, Transphorm will debut their Weltrend SiP display (APEC). The relevant WTDB 008 65W USB PD Power Adapter Evaluation Board will also be discussed during the event, according to the firms. In the second quarter of 2023, WT7162RHUG24A SiP samples will be made available.