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Substrates are composite dielectric structures consisting of glass or paper and epoxy resin. Substrates are occasionally enhanced with particular substances,…
The CTE value, which is expressed in parts per million, often increases when a substrate is subjected to temperatures over…
Substrates are composite dielectric structures consisting of glass or paper and epoxy resin. Substrates are occasionally enhanced with particular substances,…
The CTE value, which is expressed in parts per million, often increases when a substrate is subjected to temperatures over…
On these devices, there is no internal post structure (solder connection). An inventive copper clip is used to join the…
The large aperture is a huge plus because test bench operators frequently encounter the issue of power connectors
The drivers include an additional case temperature sensor that guards against overheating of the whole chip (OVC event). Channels that…
Substrates are composite dielectric structures consisting of glass or paper and epoxy resin. Substrates are occasionally enhanced with particular substances,…
The CTE value, which is expressed in parts per million, often increases when a substrate is subjected to temperatures over…
Substrates are composite dielectric structures consisting of glass or paper and epoxy resin. Substrates are occasionally enhanced with particular substances,…
The CTE value, which is expressed in parts per million, often increases when a substrate is subjected to temperatures over…
On these devices, there is no internal post structure (solder connection). An inventive copper clip is used to join the…
The large aperture is a huge plus because test bench operators frequently encounter the issue of power connectors
The gadget is the business' most latest space-qualified offering. It is produced…
The components will provide desaturation protection for the most recent fast-switching IGBTs…
On these devices, there is no internal post structure (solder connection). An…
One of the most technologically sophisticated semiconductors is wide bandgap silicon carbide…
Four new FRED Pt Gen 5 600V Ultrafast rectifiers in the TO-244…
The series complies with fundamental requirements such as small size, 125C operating…
To deactivate body diodes, Toshiba Electronic Devices & Storage Corp devised a…
BridgeSwitch combines high efficiency, design flexibility, enhanced safety, IEC 60335-1, and IEC…
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In order to meet the growing demand from ST's customers for SiC…
To its extensive selection of temperature sensors, Sensirion now offers the digital…
BridgeSwitch combines high efficiency, design flexibility, enhanced safety, IEC 60335-1, and IEC…
The majority of electronics power devices have traditionally been built using silicon, a semiconductor that…
For the lowest possible no-load input standby power performance, the new combination IC also offers…
After construction, a conformal coating, a nonconductive protective layer, is placed to the PCB to…
Designers typically have to link many devices with poor current handling capabilities in parallel in…
The 30MHz High-Voltage Differential Probes from the CT4447 Series from Cal Test Electronics are now…
The BLE32SN line of chip ferrite beads has been introduced by Murata. These are allegedly…
Specific materials, such as FEP, PTFE, ceramic, hydrocarbons, and several kinds of glass fibre, are…
Today, Taiwan Semiconductor announced the PerFET Series of single- and dual-channel 40V power MOSFETS which…
There are four available output voltages: 12, 13.8, 15, and 24V. Up to 11 units…
To its extensive selection of temperature sensors, Sensirion now offers the digital automobile sensor STS4xA.…
Printed circuit boards used in aircraft applications are exposed to harsh environmental conditions, radiation, chemicals,…
The SiC MOSFETs are designed for high-performance power electronics applications, such as power supply for…
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